DHCOM iMX6-D2: Difference between revisions

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[[Image:IM6Modul.png|600px|COM iMX6-D2]]
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* Cortex-A8 AM3505/17 @ 600 MHz
== Hardware ==
* AM3517 inclusive 3d acceleration / AM3505 without 3d acceleration
* 0 - 2048 MB SLC-NAND flash
* 64 - 512 MB DDR2-333
* MicroSD socket onboard
* Bus interface: 16 addresslines and 16 datalines
* 4-bit SD/MMC card interface
* LC-Displaycontroller, RGB, 24 Bit colour depth, 1400 x 1050 Pixel
* Touchcontroller onboard, 4-wire resistive
* Ethernet 10/100 MBit
* 2x USB Host high-speed, USB OTG high-speed
* Serial Interfaces: 3x UART, 2x I²C, 2x SPI
* CAN Interface: 1 Mbit/s
* I²S Audiocodec
* Real-time Clock RTC onboard
* Temperature range: Operating -40 to +85 °C
* SODIMM-200 Connector DHCOM Standard


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* '''Cortex-A9  Freescale i.MX6 Solo/DualLite/Dual/Quad up to 1.2GHz'''
* 2D (GC320) / 3D (GC880/GC2000) graphics accelerator
* 128 - 1024 MByte NAND flash memory (8 bit bus width) or<br/>4 - 16 GByte eMMC flash (8 bit bus width)
* 2 MB SPI boot flash
* 256 - 2048 MByte DDR3-1066 or DDR3-800
* On module microSD card socket (4 bit SDIO) <sup>[1]</sup>
* SD/MMC card interface, 4 bit SDIO
* LC display controller, 24 bit colors, 2048x1536 pixels
* LVDS 4-channel, max. 165 Mpixels/s
* On-board touch controller for 4-wire resistive touch screens
* Ethernet controller 10/100 Mbit, IEEE1588 conform
* USB 2.0 OTG high-speed
* USB 2.0 host high speed
* Full function UART <sup>[2]</sup>
* Standard UART with hardware handshake support
* Standard UART
<br/><sup>[1]</sup> On module microSD card socket is only available if second CAN port is not connected.
<br/><sup>[2]</sup> CTS and RTS is only available if second CAN port is not connected.
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* 2x CAN interface <sup>[1][2]</sup>
* 2x SPI interface
* 2x I²C interface
* I²S Audio codec (1 x microphone, 1 x Line in, 1x Line out)
* Real-time clock (I²C connection), low power temperature compensated
* 12 bit analog input
* 128 Bytes EEPROM with integrated MAC address
* 16 bit address/databus interface on SODIMM-200 socket
* PWM channel
* 24 GPIOs (A-W + INT_HI_PRIO)
* JTAG debug connection via FFC plug connector
* Industrial temperature range (-40°C to +85°C)
* SODIMM-200 socket with DHCOM pin assignment
|}


Have a look at this youtube video to get an overview of the performace of the am3517 with the NEON coprocessor and the SGX 530 Graphics Processing Unit (GPU) included.
*[[COM iMX6 Hardware|Hardware Support]]
:* [http://www.youtube.com/watch?v=5prkZHkeDFE Sitara AM3517 Processor Demonstration]


:* The NEON coprocessor implements the Advanced SIMD media processing architecture. Single instruction, multiple data (SIMD), is a class of parallel computers with multiple processing elements that perform the same operation on multiple data simultaneously. E. g. NEON is used for video encoding.
== Product Change Notifications (PCN) ==
:* The SGX 530 Graphics Processing Unit includes the Universal Scalable Shader Engine (USSE™), with a feature set that exceeds the requirements of OpenGL 2.0 and Microsoft Shader Model 3, enabling 2D, 3D and general purpose (GP-GPU) processing in a single core. This GPU is not included in the AM3505.
* [[media:PCN_iMX6_R01_2017-08-17.pdf|PCN_iMX6_R01_2017-08-17.pdf (4GByte eMMC)]]
* [[media:PCN_iMX6_R02_2017-08-17.pdf|PCN_iMX6_R02_2017-08-17.pdf (8GByte eMMC)]]
* [[media:PCN_iMX6_R03_2017-09-20.pdf|PCN_iMX6_R03_2017-09-20.pdf (SW ethernet bug)]]
* [[media:PCN_iMX6_R04_2017-09-25.pdf|PCN_iMX6_R04_2017-09-25.pdf (Molex microSD socket)]]
* [[media:PCN_iMX6_R05_2018-01-10.pdf|PCN_iMX6_R05_2018-01-10.pdf (512MB NAND flash)]]
* [[media:PCN_iMX6_R06_2018-10-09.pdf|PCN_iMX6_R06_2018-10-09.pdf (label change)]]
* [[media:PCN_iMX6_R07_2019-11-13.pdf|PCN_iMX6_R07_2019-11-13.pdf (4GByte eMMC)]]
* [[media:PCN_iMX6_R08_2019-11-13.pdf|PCN_iMX6_R08_2019-11-13.pdf (8GByte eMMC)]]
* [[media:PCN_iMX6-009_R01_2021-07-20.pdf|PCN_iMX6-009_R01_2021-07-20.pdf (SPI flash EOL)]]
* [[media:PCN_DHCOM-iMX6-010_R01_2021-12-23.pdf|PCN_DHCOM-iMX6-010_R01_2021-12-23.pdf (microSD socket EOL)]]


== Software Support ==
*[[COM iMX6 Bootloader U-Boot|i.MX6: Bootloader U-Boot]]
*[[COM iMX6 Linux|i.MX6: Linux]]
*[[DHCOM Update Mechanism|DHCOM Update Mechanism]]
* [https://github.com/dh-electronics/meta-dhsom-imx-bsp Yocto BSP meta layer --> Github]
* [https://github.com/dh-electronics/kas-dhsom Easy Yocto build via KAS --> Github]
*[[COM iMX6 WinCE|i.MX6: WinCE]]


[[COM AM35 Hardware|Hardware]]
== BSP Sources==
----
==== [https://www.denx.de/wiki/U-Boot U-Boot] ====
* [https://github.com/dh-electronics/u-boot-imx6qdl/tree/dev/legacy/2018.05_dhcom DH U-Boot (based on v2018.05)]
* [https://github.com/dh-electronics/u-boot-imx6qdl/tree/dev/2015.10_dhcom DH U-Boot (based on v2015.10)(deprecated)]
* [https://github.com/dh-electronics/u-boot-imx6qdl/tree/dev/2013.10_dhcom DH U-Boot (based on v2013.10)(deprecated)]


==== [https://www.kernel.org Linux Kernel] ====
* Mainline
:* [https://github.com/dh-electronics/linux-imx6qdl/tree/release/5.10.131_dhsom/20220725 DH 5.10.131 Release 2022-07-25]
* NXP Vendor
:* [https://github.com/dh-electronics/linux-imx6-vendor/tree/release/v4.1.15/20190926 DH 4.1.15 Release 2019-09-26]
:* [https://github.com/dh-electronics/linux-imx6-vendor/tree/release/v3.10.17/20170804 DH 3.10.17 Release 2017-08-04]


[[COM AM35 Bootloader U-Boot|Bootloader U-Boot]]
== Download binaries/images ==
----
==== U-Boot (for eMMC DHCOMs) ====
* [https://www.dropbox.com/s/i9ed2ex6x7ucj8w/u-boot-with-spl_imx6_v2.3.1.0_emmc.imx?raw=1 DH U-Boot v2.3.1.0 (based on v2018.05)]
* [https://www.dropbox.com/s/e6dl6srzj5tbfot/v1-1-0-8_u-boot-imx6qdl.tar.xz?raw=1 DH U-Boot v1.1.0.8 (based on v2015.10)]
: More on how to program it with the U-Boot command "update bootloader ..." on the page [[DHCOM Update Mechanism#Commandline Mode|"DHCOM Update Mechanism"]]


==== Update Kernel ====
* Please contact DH electronics if you need a binary.
: More on how to use it on the page [[DHCOM Update Mechanism|"DHCOM Update Mechanism"]]


[[COM AM35 WinCE|WinCE]]
==== Debian based images ====
----
* Debian 10 "Buster" + Kernel 5.10.131 Release 2022-08-19
: Note: Devicetree is set to "imx6q-dhcom-pdk2.dtb" in uLinuxEnv.txt


:* [https://www.dropbox.com/s/5qr7mayxmh9egvf/HD00035_2022-08-19_imx6_buster_sdcard_2000MB.img.xz?raw=1 SD card: 2GB image (xz compressed)]
:: Open it with Disks by double click on Debian Linux. Use [https://www.balena.io/etcher balenaEtcher] on Windows.


[[COM AM35 Linux|Linux]]
:* [https://www.dropbox.com/s/r1tv1dmeqzt5gnl/HD00035_2022-08-19_imx6_buster_USB_stick_update.zip?raw=1 eMMC: USB stick update image]
----
:: Extract the files on a USB stick (MBR / FAT32) and insert it into your board / device. More about the files on the page [[DHCOM Update Mechanism|"DHCOM Update Mechanism"]]
 
* Debian 8 "Jessie" with Qt5.9.1 + Vendor Kernel 4.1.15 Release 2019-09-26
 
:* [https://www.dropbox.com/s/18f4hsj3lhp6e5w/HD00039_2019-09-26_imx6_jessie_qt5.9.1_sdcard_2000MB.img.xz?raw=1 SD card: 2GB image (xz compressed)]
:: Open it with Disks by double click on Debian Linux. Use [https://www.balena.io/etcher balenaEtcher] on Windows.
 
:* [https://www.dropbox.com/s/3c6b96g7ijzkoay/HD00039_2019-09-26_imx6_jessie_qt5.9.1_USB_stick_update.zip?raw=1 eMMC: USB stick update image]
:: Extract the files on a USB stick (MBR / FAT32) and insert it into your board / device. More about the files on the page [[DHCOM Update Mechanism|"DHCOM Update Mechanism"]]
 
Hint: You can also progam the eMMC by using the [[COM iMX6 Bootloader U-Boot#USB Mass Storage|U-Boot command "ums"]] (usable since U-Boot v2018.05)
 
== Download Linux code examples ==
==== [[Virtual Machine for Application Development#Code Examples for Userspace-Applications to Access SPI, I2C, GPIOs, and more|Code Examples for Userspace-Applications to Access SPI, I2C, GPIOs, and more]] ====
 
== Download WEC ==
==== WEC7 DHHalLib.dll (function library) ====
* [[media:DHHalLib_WEC7_R11_2022-05-11.zip|Download DHHalLib Library Version 1.3.0.7]]
* [[media:DHHalLib_Test_App_Source_WEC7_R10_2022-04-06.zip|DHHalLib Demo App Source Code ]]
* [[media:DHHalLib_Test_App_Binary_WEC7_R10_2022-04-06.zip|DHHalLib Demo App Binary File]]
* [[media:CSharp_LibWrapper_Source_WEC7_R09_2022-03-18.zip|Download DHHalLib CSharp Wrapper]]
* [[media:CSharp_LibWrapper.zip|Download DHHalLib CSharp Demo Wrapper App ]]
* [[media:CSharp_LibWrapper_Binary.zip|Download DHHalLib CSharp Demo Wrapper App Binary File]]
 
==== WEC7 binary BSP ====
* [[media:2016-05-19_DHCOM_iMX6_BSP_BIN.zip|Download WEC7 binary BSP (date: 2016-05-19)]]
 
==== WEC2013 DHHalLib.dll (function library) ====
* [[media:DHHalLib_WEC2013_R12_2021-10-01.zip|Download DHHalLib Library Version 1.4.2.2]]
* [[media:DHHalLib_Test_App_Source_WEC2013_R07_2018_06_12.zip|DHHalLib Demo App Source Code ]]
* [[media:DHHalLib_Test_App_Binary_WEC2013_R09_2021-10-01.zip|DHHalLib Demo App Binary File]]
* [[media:CSharp_LibWrapper_Source_WEC2013_R07_2021-10-01.zip|Download DHHalLib CSharp Wrapper]]
* [[media:CSharp_DHHalLib_Wrapper_App_Source_WEC2013_R05_2017_08_08.zip|DHHalLib C# Demo App Source Code]]
* [[media:CSharp_DHHalLib_Wrapper_App_Binary_WEC2013_R05_2017_08_08.zip|DHHalLib C# Demo App Binary File]]

Latest revision as of 09:33, 4 April 2023

COM iMX6-D2

Hardware

  • Cortex-A9 Freescale i.MX6 Solo/DualLite/Dual/Quad up to 1.2GHz
  • 2D (GC320) / 3D (GC880/GC2000) graphics accelerator
  • 128 - 1024 MByte NAND flash memory (8 bit bus width) or
    4 - 16 GByte eMMC flash (8 bit bus width)
  • 2 MB SPI boot flash
  • 256 - 2048 MByte DDR3-1066 or DDR3-800
  • On module microSD card socket (4 bit SDIO) [1]
  • SD/MMC card interface, 4 bit SDIO
  • LC display controller, 24 bit colors, 2048x1536 pixels
  • LVDS 4-channel, max. 165 Mpixels/s
  • On-board touch controller for 4-wire resistive touch screens
  • Ethernet controller 10/100 Mbit, IEEE1588 conform
  • USB 2.0 OTG high-speed
  • USB 2.0 host high speed
  • Full function UART [2]
  • Standard UART with hardware handshake support
  • Standard UART


[1] On module microSD card socket is only available if second CAN port is not connected.
[2] CTS and RTS is only available if second CAN port is not connected.

  • 2x CAN interface [1][2]
  • 2x SPI interface
  • 2x I²C interface
  • I²S Audio codec (1 x microphone, 1 x Line in, 1x Line out)
  • Real-time clock (I²C connection), low power temperature compensated
  • 12 bit analog input
  • 128 Bytes EEPROM with integrated MAC address
  • 16 bit address/databus interface on SODIMM-200 socket
  • PWM channel
  • 24 GPIOs (A-W + INT_HI_PRIO)
  • JTAG debug connection via FFC plug connector
  • Industrial temperature range (-40°C to +85°C)
  • SODIMM-200 socket with DHCOM pin assignment

Product Change Notifications (PCN)

Software Support

BSP Sources

U-Boot

Linux Kernel

  • Mainline
  • NXP Vendor

Download binaries/images

U-Boot (for eMMC DHCOMs)

More on how to program it with the U-Boot command "update bootloader ..." on the page "DHCOM Update Mechanism"

Update Kernel

  • Please contact DH electronics if you need a binary.
More on how to use it on the page "DHCOM Update Mechanism"

Debian based images

  • Debian 10 "Buster" + Kernel 5.10.131 Release 2022-08-19
Note: Devicetree is set to "imx6q-dhcom-pdk2.dtb" in uLinuxEnv.txt
Open it with Disks by double click on Debian Linux. Use balenaEtcher on Windows.
Extract the files on a USB stick (MBR / FAT32) and insert it into your board / device. More about the files on the page "DHCOM Update Mechanism"
  • Debian 8 "Jessie" with Qt5.9.1 + Vendor Kernel 4.1.15 Release 2019-09-26
Open it with Disks by double click on Debian Linux. Use balenaEtcher on Windows.
Extract the files on a USB stick (MBR / FAT32) and insert it into your board / device. More about the files on the page "DHCOM Update Mechanism"

Hint: You can also progam the eMMC by using the U-Boot command "ums" (usable since U-Boot v2018.05)

Download Linux code examples

Code Examples for Userspace-Applications to Access SPI, I2C, GPIOs, and more

Download WEC

WEC7 DHHalLib.dll (function library)

WEC7 binary BSP

WEC2013 DHHalLib.dll (function library)